EPOXY ADHESIVES
SMT Red Adhesive
SMT Assembly · Component Fixing
A one-part, fast heat-curing epoxy adhesive for fixing components to circuit boards during SMT processing.
One-part, fast heat curingSuitable for stencil printing and dispensingHigh bond strength and resistance to high-temperature shock
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APPLICATION & PACKAGING
Main Applications
Fixing surface-mount components in power supplies, bonding electronic-product parts and fixing chip corners.
SUPPLY FORMAT
Packaging
20 ml / 30 ml syringes; 200 ml / 300 ml cartridges
Typical Models
View Product Brochure| Model | Appearance | Features / Applications |
|---|---|---|
| 2201 | Red paste | Manual stencil and thick-board printing |
| 2202 | Red paste | Manual stencil and thick-board printing |
| 2203 | Red paste | Automated dispensing and stencil printing |
Selection depends on substrates, structure and process conditions. Always check the latest model documentation.
APPLICATION SUPPORT