EPOXY ADHESIVES
One-Part Epoxy Adhesive
Precision Assembly · Heat Curing
A one-part epoxy system requiring no on-site mixing, intended for high-yield precision electronics assembly, with models for low-temperature curing, bonding and potting.
No mixing; ready to useChoice of curing processes and viscositiesPrecision component bonding, reinforcement and potting
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APPLICATION & PACKAGING
Main Applications
Bonding metals and heat-sensitive components; chip and Mini LED corner fixing, bonding and underfill; relay and sensor potting.
SUPPLY FORMAT
Packaging
30 cc / 50 cc syringes
Typical Models
View Product Brochure| Model | Curing Conditions | Features / Applications |
|---|---|---|
| 2522-9 | 75°C × 8 min | Fast low-temperature cure; reworkable |
| 2522-4 | 75°C × 8 min | Fast low-temperature cure |
| 2524-1 | 120°C × 0.5 h or 100°C × 1 h | Low viscosity; optical-grade transparency |
Selection depends on substrates, structure and process conditions. Always check the latest model documentation.
APPLICATION SUPPORT