EPOXY ADHESIVES
Two-Part Epoxy Potting Compound
Insulating Potting · Protective Sealing
A two-part epoxy insulating potting compound for electronic components and connectors, with room-temperature or heat-curing options.
Addresses a range of potting processesMechanical and insulating properties after curingLow-stress and flexible models available
Ask About This Product
APPLICATION & PACKAGING
Main Applications
Insulating encapsulation of electronic components, connector potting, and sealing electronic devices against moisture.
SUPPLY FORMAT
Packaging
10 : 1 / 5 : 1 packaging
Typical Models
View Product Brochure| Model | Mixing Ratio | Features / Applications |
|---|---|---|
| 5173 | 10 : 1 | High thermal conductivity and density |
| 5353 | 10 : 1 | High heat resistance |
| 5521 | 5 : 1 | Low-stress cushioning |
Selection depends on substrates, structure and process conditions. Always check the latest model documentation.
APPLICATION SUPPORT