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02 / SEMICONDUCTOR & COMPONENTS

Semiconductors & Components

Reliable connections for precision electronics.

From SMT assembly to chip fixing, reinforcement and underfill, materials for electronic-component assembly and protection.

  • SMT Assembly
  • Chip Corner Bonding
  • Component Reinforcement & Potting
AllApplications
Circuit-board dispensing and chip-fixing application image from the product brochure
Semiconductors & Components
MATERIAL REFERENCE

Related Adhesive Materials

Explore Selection Methods
SMT red adhesive packaging, from the ANGUBANG product brochureEPOXY ADHESIVES

SMT Red Adhesive

SMT Assembly · Component Fixing

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One-part epoxy adhesive packaging, from the ANGUBANG product brochureEPOXY ADHESIVES

One-Part Epoxy Adhesive

Precision Assembly · Heat Curing

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Two-part epoxy potting compound packaging, from the ANGUBANG product brochureEPOXY ADHESIVES

Two-Part Epoxy Potting Compound

Insulating Potting · Protective Sealing

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This material index reflects applications covered by the product brochure. Suitability of a specific model must be confirmed against the actual substrates and process.

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